New Southbound Policy Mandarin and Semiconductor Short-term Study Program
New Southbound Policy Mandarin and Semiconductor Short-Term Study Program offered by the National Taipei University of Technology (NTUT). Through this program, students will have the opportunity to study semiconductor courses alongside Chinese language courses at NTUT. Successful applicants will receive funding, which includes airfare, living expenses, housing, and tuition fees, all provided by the Ministry of Foreign Affairs (MOFA). Participants will not only enhance their language skills but also engage in cultural activities, learn about the semiconductor industry, and meet new people. The short-term study program will run from 11th September 2023 to 12th January 2024, spanning a duration of five months. To apply for this program, interested students must submit the following application materials: 1. Passport copy (Photo) 2. Enrollment Letter from your university 3. Curriculum Vitae (CV) Eligibility criteria for the program are as follows: 1. The applicant should be a sophomore, junior, or senior from universities in New Southbound countries. 2. The applicant should not hold a passport from the People's Republic of China (including Hong Kong and Macau) or Taiwan (Republic of China). 3. The applicant should not be a recipient of other financial aid from the government, agencies, or educational institutions of Taiwan. The application deadline is 3rd July 2023. For further information or inquiries, please feel free to contact us via email at cltc@mail.ntut.edu.tw. To apply, please follow the link provided: https://docs.google.com/.../1FAIpQLSelv42jkSIf.../viewform
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IPSA Summer School in Paris: DEVELOP | CONTROL | FLY
*For Current Full Time ISE Students only* 3 weeks, from July 3 to July 21 (check-in on July 3 and check-out on July 21). All participants completing the program will be rewarded with 6 ECTS (European credits). The program covers accommodation, material kit, cultural activities, lunch, and coffee breaks on course days, public transport pass in Paris. Program fee: Students coming from our Exchange partners benefit from a discount. With the discount applied, students from our Exchange partners must pay 1.850 euros (instead of 2.650 euros) in order to cover the logistics expenses detailed above. Application: In order to apply, students must send the following documents to international@ipsa.fr Application form (attached) Copy of passport Official transcripts from home university Proof of English language proficiency (B2 level) Application fee (60 euros)* *Students from our Exchange partners are exempted from the application fee. Application deadline: 15th of May. We recommend students to apply before as spots are limited. For more details, please visit the website: https://summer-schools.fr/school-ipsa/ and to find attached the flyer and the application form. Students who would like to attend this program, please contact the ISE office at ise_exchange@chula.ac.th
6 February 2023
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ISE Summer School 2022
Scholarship Announcement ISE Summer School Scholarship for CLMV and People's Republic of China Students ISE Summer School Announcement ISE Summer School AY 2022 To acquire login information, potential applicants should first send an email to moodle@eng.chula.ac.th providing full name and email address. Important Dates February 1, 2023 Opening the online application March 7, 2023 Deadline of application submission March 31, 2023 Notification of admission April 7, 2023 Due payment of tuition and program fees May 15-17, 2023 Course registration June 6-July 21, 2023 Regular summer program July 3-21, 2023 Intensive summer program Contacts Information Summer School Program Coordinator International School of Engineering, Faculty of Engineering, Chulalongkorn University Room 107, Engineering 2 Building, 254 Phayathai Road, Pathumwan, Bangkok 10330, Thailand Telephone: +66 2 218 6422-4 | Fax: +66 2 218 6422 | Email: ise_summer@chula.ac.th
2 February 2023
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The 9th Joint Symposium between IBB/TMDU and Chulalongkorn University on “Biomedical Materials and Engineering”
The 9th Joint Symposium between IBB/TMDU and Chulalongkorn University on “Biomedical Materials and Engineering” Date: January 23, 2023 Time : 9:00am - 4:15pm Venue: Room213, Bldg.3, Faculty of Engineering, Chulalongkorn University Program The 9th Joint Symposium between IBB/TMDU and Chulalongkorn University on “Biomedical Materials and Engineering” Program
19 January 2023
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International master's programs from Tsinghua University
17 January 2023